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Encapsulation Materials for Neural Interface Devices

Language EnglishEnglish
Book Paperback
Book Encapsulation Materials for Neural Interface Devices Jui-Mei Hsu
Libristo code: 06822710
Publishers VDM Verlag, April 2009
Neural interface devices have been developed for §neuroscience and neuroprosthetics applications to... Full description
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Neural interface devices have been developed for §neuroscience and neuroprosthetics applications to §record and stimulate nerve signals. Chronic use of §these devices is prevented by their lack of long-§term stability, due to device failure or immune §system responses. §Conformal, hermetic, biocompatible, and electrically §insulating coating materials that sustain chronic §implantation and guarantee stable recording or §stimulation are needed. Even though a large §selection of materials has been proposed and tested §for this purpose, to date, no material §presented in scientific literature has been §thoroughly characterized and qualified as a long-§term hermetic encapsulation material for silicon-§based neural interface devices. §In this work, hydrogenated amorphous silicon carbide §(a-SiCx:H) and Parylene-C films were investigated as §the encapsulation materials. The deposition §parameters and corresponding film properties were §explored and correlated with the encapsulation §characteristics.

About the book

Full name Encapsulation Materials for Neural Interface Devices
Author Jui-Mei Hsu
Language English
Binding Book - Paperback
Date of issue 2009
Number of pages 184
EAN 9783639140750
ISBN 3639140753
Libristo code 06822710
Publishers VDM Verlag
Weight 277
Dimensions 152 x 229 x 11
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